The resist is set at 0.13 absolute larger than the pad size. The copper pour is exposed by this resist area . Making the pad larger than size set. It exposes the tinned area so enlarges the pad.
I was expecting the pads to ignore the resist setting when sitting in a copper pour area. They obviously don't.
I understand where you are coming from now. I agree, the pad itself does "appear" to get bigger, but only because EPC highlights the resist, (if added as a layer) and not the the copper pad itself.
Increasing the resist clearance setting by a large factor causes the illusion of the copper pads of connectors overlapping! But they don't short out,- as the DRC does not show then as shorting out/overlapping and the plots will be fine. This happens even without a flood plane. The pad diameter stays constant, but if the pad is in a flood plane area then obviously the copper area will appear to "grow" by the resist clearance annulus. It can't do anything else!
There is no distinction between the copper of a pad and the copper of a pour. It's all the same copper. The resist layer simply exposes the areas required whether it be pads or anything else.
Pad resist on copper pour
Posted - 07 Jul 2014 : 17:34:28
