| T O P I C R E V I E W |
| AndyB |
Posted - 07 Jul 2014 : 17:34:28
The resist makes the pad larger when using a copper pour around a pad when spikes are not used.
I would have thought that Easy PC would remove the resist layer automatically when non spiked.
I know that I could add an exception on the pad but there are other pads that are not in the copper pour or have spikes.
Is there any setting to enable this?
|
| 8 L A T E S T R E P L I E S (Newest First) |
| AndyB |
Posted - 15 Aug 2014 : 18:56:36
The pads may be on and off the copper pour.
So I would have to do that on every pad.
I feel that this is an easy mod for the software guys to add.
Should be there anyway. |
| Iain Wilkie |
Posted - 05 Aug 2014 : 11:27:50
You could of course simply edit the resist mask for that pad
Iain |
| AndyB |
Posted - 04 Aug 2014 : 22:10:45
Iain dont you think that the pads that are "not isolated from plane" should have the resist reduced to make the pad the correct size.
Easy Pc should be able to do that automatically.
|
| AndyB |
Posted - 23 Jul 2014 : 10:51:33
Maybe this should be something NOS can look into and add in the next version.
Components if not glued self right on the pad when reflowing.
I have designed LED pcb's that have lenses and the positioning is important.
|
| Iain Wilkie |
Posted - 20 Jul 2014 : 17:42:31
There is no distinction between the copper of a pad and the copper of a pour. It's all the same copper. The resist layer simply exposes the areas required whether it be pads or anything else.
Iain |
| edrees |
Posted - 20 Jul 2014 : 14:52:27
I understand where you are coming from now.
I agree, the pad itself does "appear" to get bigger, but only because EPC highlights the resist, (if added as a layer) and not the the copper pad itself.
Increasing the resist clearance setting by a large factor causes the illusion of the copper pads of connectors overlapping! But they don't short out,- as the DRC does not show then as shorting out/overlapping and the plots will be fine. This happens even without a flood plane. The pad diameter stays constant, but if the pad is in a flood plane area then obviously the copper area will appear to "grow" by the resist clearance annulus. It can't do anything else! |
| AndyB |
Posted - 20 Jul 2014 : 12:29:37
The resist is set at 0.13 absolute larger than the pad size.
The copper pour is exposed by this resist area .
Making the pad larger than size set.
It exposes the tinned area so enlarges the pad.
I was expecting the pads to ignore the resist setting when sitting in a copper pour area.
They obviously don't.
|
| edrees |
Posted - 07 Jul 2014 : 17:45:47
quote:
The resist makes the pad larger when using a copper pour around a pad when spikes are not used.
Not sure I understand what you mean!
How can the resist layer make a pad larger?
Spikes =>spokes as in thermal reliefs? |
