I have done a quick test and there is no difference. I have a through hole connector with only one pin connected to GND. I want to create a solid connection on the pin (no thermal pad) and leave the rest of the design with thermal pads. I tried the 3 options on the Plane Connection pane and I could not see any difference
Yes, I did. I cleared the copper and poured it back again. EZPC will add thermal regardless of the option chosen on the Plane Connection Pane. Basically, it seems that option does nothing
When I pour the copper I click on the box Thermal on Pads. That's what I have been doing. Iain, is that the box that you meant when you said thermal box? I am using Easy-PC v.15.0.7
When I pour the copper I click on the box Thermal on Pads. That's what I have been doing. Iain, is that the box that you meant when you said thermal box? I am using Easy-PC v.15.0.7
Drod
Ah ..... this only works for copper pour in V16. The feature does not apply to V15 ....
You do have a choice of applying a work arround to V15 or upgrade to V16 depending upon which would be most benifit to you !.
for V15 & older you can use work arrounds discussed in PCB topic 530 Feature Request - Exemption from thermal relief !. There you can either use pad exception to oversize the effected pads when copper has been poured but needs reset when new copper pour is done or place a small bit of copper pour arround the desired pads with thermal relief turned off then pour main copper with normal settings.
selectively add thermals on pads
Posted - 13 Aug 2012 : 13:58:24
