I am using copper pour - and Easy-PC v14.05 - with thermal relief and spokes.
I have at least 1mm space of copper on two of the sides of the capacitor pad - yet these do not have thermal spokes applied.
I have changed the spoke size from 1mm to 0.5mm and quadrants of the PAD that did not have spokes now have spokes.
What is the rule for spokes being applied to PAD sides where the PAD is close to a copper pour edge or another PAD ?.
Depending on the circuit - i wish to increase the spoke width to ensure better conduction - but do need the thermal relief as soldering large capacitors with multiple layer connections without thermal relief was difficult.
The spoke has to have 'room' so that it doesn't fall foul of DRC spacings, and also has to have a 'clean' point on the copper where it can fit without overhanging the far edge, straddling a vertex, etc.
If you want us to look at your particular example and see if the lack of spokes is really warranted according to the algorithm, please send a copy of the design to Support with a note about where to look.
Spokes - Missing on Copper Pour
Posted - 11 Jun 2011 : 11:52:10
