Not sure if this is supported - manuals do not seem to state so - can you apply necking to a track that does NOT break any of the design rules.
Since the design rule is not broken, the large track overwrites the footprint of the SMD PAD without breaking the design rules - hence can this be a new feature - allow for the forcing of necking on the end of a track ?.
On a simiar note - since i am using SMD based Op-Amps, i would like to increase the size of the track as i move away from the SMD package where there is more PCB space available.
The change from one track thickness to another much larger track thickness looks rather bad if the step size if 0.5mm to 2.0mm.
Is it possible to apply a graduated conversion between two track thicknesses ?.
Necking into SMD Pads
Posted - 09 Aug 2010 : 21:00:24
