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Gerbil Posted - 28 Jun 2013 : 09:47:59
My PCB manufacturer has requested that the paste mask for the centre pad of a QFN chip be reduced in size and that evenly distributed apertures be added to prevent the component rising during reflow and affecting the integrity of the outer terminal connections.

Is this possible within Easy-PC, or will I have to buy third party gerber editing software such as GC-PrevuePlus? GraphiCode have assured me that their software will do the job, but if there is a trick to doing it within Easy-PC then it may save repeating the exercise after future board revisions.
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Gerbil Posted - 28 Jun 2013 : 11:04:47
Thanks Ed. I'd kind of got that far, but couldn't see a way to suppress or edit the individual pad.

Some further digging turned up an FAQ with the solution. http://www.numberone.com/faq.aspx?KB020033

I wouldn't have kept looking without your confidence that it was possible, so thanks again.

Greg
edrees Posted - 28 Jun 2013 : 10:00:34
You add a solder paste mask as an additional layer. Once you hace done that you can add "closed shapes (rectangles etc) in that layer to create "evenly distributed apertures" although I have never come across this requirement before.

You can adjust the solder paste layer relative/absolute size with respect to the copper padspads in Design Tech => Layer Types, or in the "pads only" setting in the plotting dialog box.