| T O P I C R E V I E W |
| G.Walker |
Posted - 01 Feb 2007 : 09:18:22
Hi,
Since using V10.04 update I have problems with copper pour which is worse with designs created in V10 to V10.03 .
After clearing Copper Pour from an area and then applying Copper Pour again , the whole PCB area is flooded with Copper .
This is worse where the area contains multiple nets so that single net areas usually refill OK.
I have currently reverted to V10.03 but then find designs in V10.0.4 suffer a similar problem in that removing Copper Pour and then refilling results in no Copper Pour at all ! |
| 5 L A T E S T R E P L I E S (Newest First) |
| shadders |
Posted - 07 Oct 2010 : 21:29:13
Hi Peter,
Thanks - i should have updated the thread - i spoke to the technical support - and they are looking at the design - i started to remove many of the components to see what was causing the error.
What the technical support stated did help - that is, the thickness of the copper pour area bounding line can be changed to a non integer fraction of the fill area as an example. The line was set to 0.15mm, and i chnged this to 0.1mm and the fill area completed ok.
I think this is possibly a tip to be placed in the manual - solves the problem whilst the technical support are examining the detail.
Thanks and regards,
Richard. |
| Peter Johnson |
Posted - 07 Oct 2010 : 12:05:58
This does not sound like the V10 problem, which was caused by a coding error.
The pour algorithm is extremely complex, and becoming more so as code for special cases which defeat the basic algorithm is added. This sounds like another such instance.
It can't even be investigated without a copy of the design, as the problem will be so specific that the design is necessary to establish the parameters for it.
Please send a copy of the design to the support desk, with a comment referring back to this thread. |
| shadders |
Posted - 03 Oct 2010 : 23:08:15
Hi,
I am now getting this error in v14.01.
I modified a few tracks, added a copper fill area under an SMD component (5mm x 5mm) and when i try to fill the entire digital top copper section of the board i obtain this error.
I have moved the edges of the copper fill outline to exclude some of the tracks i modified connecting to an IDC connector, and the copper pour works.
I then delete the entire copper fill area, create another arround the IDC connector which seems to be causing the problem - it works - copper fills ok.
I extend the copper fill area to the entire digital section again, and i get the error.
Any ideas if anyone else is receiving this error ?,
Is it due to a component or track not correctly formed ?.
Thanks and regards,
Richard. |
| Peter Johnson |
Posted - 05 Feb 2007 : 10:47:52
Unfortunately, in fixing a different copper pour problem that was present in 10.0.3, something rather more major has been broken. At present it's being intensively investigated. We've got several examples, but more are welcome. Send them to <support@numberone.com>. Look out for a new release (10.0.5) when it's been fixed.
Peter Johnson
Technical Support
Number One Systems |
| olga |
Posted - 02 Feb 2007 : 10:07:36
I've had the same (or a similar) problem: I have a board which has two copper areas (one is 0V, the other is 3.3V). If I try to pour the 0V (larger) area, I get a 'No copper area was large enough to be retained' error. If I try to pour the 3.3V area, the copper pour goes everywhere, including over tracks & vias which are not on the 3.3V net.
I reported this to Tech Support on the 26th of January, so they have been made aware that there's a problem! |
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