| T O P I C R E V I E W |
| KevL |
Posted - 06 Jan 2011 : 17:58:51
PCB footprints can be made to include odd shaped pads (made from copper filled shapes). But the pcb package does not remember to treat these odd pads correctly when pouring polygons (no thermal relief) and with respect to solder and paste masks.
The masks should surely be generated automatically - just like pads and the shaped pads should surely also be correctly dealt with in terms of thermal relief.???? |
| 1 L A T E S T R E P L I E S (Newest First) |
| Peter Johnson |
Posted - 22 Feb 2011 : 10:56:16
Well, within reason, anything can be programmed, but it's very definitely a special case.
The biggest issue here is that even your suggestion wouldn't be right, as a large number of devices (probably the majority) which use large pads for heatsinking also have special requirements for resist and especially for paste, so *any* automatically generated shapes would be a non-starter. |
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