| T O P I C R E V I E W |
| fyates |
Posted - 28 Jun 2008 : 18:20:51
I created a pad that is .188" X .313" for soldering board to board interconnect wires. The problem is that during creation both a resist and paste shape were also added.
How do I eliminate them and/or stop this from happening? |
| 5 L A T E S T R E P L I E S (Newest First) |
| Peter Johnson |
Posted - 02 Jul 2008 : 10:55:04
You haven't given a lot of detail here, but I'm guessing that you're referring to the Gerber files that are automatically created.
The bottom line is that if you're asking for resist and paste on surface mount pads in general, there's no way to exclude specific pads from these files, other than by editing the Gerber itself.
However, you don't need to use these files. The alternative is to create dedicated paste and resist layers within your design, then use pad exceptions to control the behaviour of specific pad styles. It can be quite a bit of extra work, but details of how to do this are in the FAQ ' Creating a solder mask for BGA components' on the FAQ page:
http://www.numberone.com/faq.asp?S=contents |
| fyates |
Posted - 01 Jul 2008 : 21:13:31
I found a way around the "tieing" the planes together problem.
If I pour the planes first and them place my Large Therm pads it does not relieve around them.
But if I unpour and repour it does. |
| DavidM |
Posted - 01 Jul 2008 : 10:01:37
You can 'suppress' a particular pad (or more accurately, all pads using a particular style) from a specific layer. You do this by going to the Pad list in the Styles dialog, using 'Add Exception' and choosing the required layer and setting the size to zero.
This has the effect of over-riding the default appearance/size of the pad on that layer.
If pads are coloured differently to what you expect, you will probably find that this is because they are the same size on your resist layer as they are on the default (through-hole) layer.
As for the Pour, in the current version of software you can't stop those pads from getting thermal relief. You can suppress it for vias, but not pads. This will be possible in version 12 (as well as setting thermal settings that are retained on each pour area). |
| fyates |
Posted - 01 Jul 2008 : 01:07:36
It is a suface mount pad and I don't want any paste on it. So how do I handle it?
From your comment the resist mask is a negative mask, correct? Where the color is, is where the resist will not be.
I have my resist layer set to a sort of purple, but it shows deep red. What have I done wrong?
My other probelm is that I am trying to tie a top and botom pour layer together with drill thrus. I creadted a pad "Large Therm" with .020 width and .024 drill plated. It "relieves the top and bottom pour. How do I get around this? |
| Iain Wilkie |
Posted - 29 Jun 2008 : 11:25:22
Well you will need a resist mask, or it will be covered by resist. If its through-hole you can uncheck this in the solder paste mask, or the solder paste will simply pre-solder the connection
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