T O P I C R E V I E W |
jlawton |
Posted - 19 Nov 2010 : 14:38:42 I have created a smt Led part which has large pads (larger than the part) for heat dissipation reasons.
To prevent the component swimming about on the large pads I would like to add resist to the pads to define areas for solder and solder paste.
Can this be done for the library part - I don't want to modify a board with 50 - 90 leds on!
John |
4 L A T E S T R E P L I E S (Newest First) |
jlawton |
Posted - 24 Nov 2010 : 15:33:15 Thanks Peter.
John
John Lawton Electronics |
Peter Johnson |
Posted - 23 Nov 2010 : 11:51:20 The alternative method is to define custom resist and paste layers. You can edit an existing technology file and save it under a different name as 'your' copy. Use pad exceptions to change the pad size on the resist and paste layers, then add filled shapes on the layers to define any off-centre areas.
If you're adding shapes to the copper, then use the shape properties to link it to a pad by number. That way it will link to the same net as the pad. |
jlawton |
Posted - 19 Nov 2010 : 17:06:40 Thanks, that's very helpful.
John
John Lawton Electronics |
Iain Wilkie |
Posted - 19 Nov 2010 : 16:32:39 Just tried it .... yes you can. Make sure you construct the area where you want no resist and paste as "pads" ..... anything else use copper shape (filled) .... if the shape needs to be connected to the "pad" (and is touching it) in the properties box simply give it the pad number.
Iain |